| 发明名称 |
ADHESIVE, MULTILAYERED CIRCUIT BOARD, SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive excellent in electrical connection reliability and ion migration resistance of resin after sealing, a multilayered circuit board, a semiconductor component, and semiconductor device. <P>SOLUTION: An adhesive of this invention adheres to a surface which has a first terminal joined by solder The adhesive includes an epoxy resin, a curing agent, and a flux activity compound containing a carboxyl group and/or phenolic hydroxyl. The epoxy resin contains a glycidyl amine type epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012079880(A) |
申请公布日期 |
2012.04.19 |
| 申请号 |
JP20100223042 |
申请日期 |
2010.09.30 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
HAYASHI NOBUAKI;MAEJIMA KENZO;KATSURAYAMA SATORU;MOCHIZUKI SHUNSUKE |
| 分类号 |
H01L21/60;C09J7/00;C09J11/04;C09J133/00;C09J163/00;C09J171/10;H05K1/18 |
主分类号 |
H01L21/60 |
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