| 摘要 |
<P>PROBLEM TO BE SOLVED: To transport a thin substrate without contacting with a substrate effective area in a reflow device. <P>SOLUTION: In this reflow device, a heated object such as a printed wiring board, to which a semiconductor element is mounted, is inserted in a furnace having a reflow zone and at least one preheating zone from a device carry-in section, and the semiconductor element mounted to the heated object is soldered while being transported in the furnace. The reflow device comprises a transporting conveyor for locating the printed wiring board on its top face and transporting it in the furnace, and a holding conveyor opposed to the transporting conveyor in a vertical direction to sandwich the substrate, and pressing and holding the printed wiring board from the top face. <P>COPYRIGHT: (C)2012,JPO&INPIT |
