发明名称 LED HEAT-CONDUCTING SUBSTRATE AND ITS THERMAL MODULE
摘要 An LED heat-conducting substrate and its thermal module wherein the composite heat-conducting substrate is incorporated by multiple heat-conducting wires or fibers and insulating material. Said wires or fibers are arranged at interval, and penetrate the front and rear faces. The wires or fibers are segregated by insulating material. An electrode pad is incorporated onto the front face of the composite heat-conducting substrate, and is electrically connected with the electrode pin of LED unit. A heat-conducting pad is incorporated and kept in contact with the heat sink of the LED component for heat conduction. An insulating layer is incorporated onto the rear face of the composite heat-conducting substrate, and located correspondingly to the electrode pad. The LED heat-conducting substrate and thermal module can be constructed easily for high heat conduction in the thickness direction and high electrical insulation in the direction of plane, enabling quick heat transfer to the heat-sinking component.
申请公布号 US2012092833(A1) 申请公布日期 2012.04.19
申请号 US20100903710 申请日期 2010.10.13
申请人 CHANG YI-SHUN;CHENG SYH-YUH;HO CHENG INDUSTRIAL CO., LTD. 发明人 CHANG YI-SHUN;CHENG SYH-YUH
分类号 H05K7/20 主分类号 H05K7/20
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