| 摘要 |
The invention relates to a heat sink for an interchangeable expansion module that can be connected to a computer board, said heat sink having at least one cooling module in which a coolant flows, and at least one first electrical connector, wherein said expansion module (4) has at least one second electrical connector configured to be connected to said first electrical connector of said board, and has at least one heat-exchange surface (18, 19), said heat sink (20) comprising at least one heat-transfer device (21) configured to be removably placed against said exchange surface (18, 19), and said device (21) further being configured such that it is in thermal contact with said cooling module and is mechanically attached, in a removable manner, to said cooling module of said board when said extension module (4) is connected to said board. |
