发明名称 LIGHT-EMITTING DEVICE MOUNTING BOARD AND LIGHT-EMITTING DEVICE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting device mounting board which has excellent reliability as a lighting apparatus owing to a fact that it hardly causes deterioration or discoloration due to light or heat emitted from a light-emitting device, and which is capable of achieving both high reflectivity and high heat dissipation at the same time, and also to provide a light-emitting device package. <P>SOLUTION: A light-emitting device mounting board comprises: a conductor circuit; and a base material supporting the conductor circuit. In the light-emitting device mounting board, a wiring board obtained by forming, on the base material, an opening which serves as a light-emitting device mounting part is attached to a metal plate arranged below the wiring board. The base material used as the wiring board may be a base material having no glass fibers, a base material using glass nonwoven fabric, or a base material using silicone resin. An end face of the opening formed on the base material is exposed to the inner side of the opening serving as the light-emitting device mounting part. The invention also provides a light-emitting device package using the light-emitting device mounting board. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079778(A) 申请公布日期 2012.04.19
申请号 JP20100221194 申请日期 2010.09.30
申请人 HITACHI CHEM CO LTD 发明人 YOSHIDA HIDEKI;SUGIURA RYOJI;SHIMIZU AKIRA;OKUBO YOSUKE
分类号 H01L33/48 主分类号 H01L33/48
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