| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a thermosetting composition producible of a printed wiring board having low dielectric constant and low dielectric loss tangent in a high frequency region of ≥10 GHz, low moisture absorption, low dielectric drift properties and good peeling strength of metal foil; and a thermosetting composite sheet and a metal-clad laminate using the composition. <P>SOLUTION: This method for producing a thermosetting composition comprises: a step of obtaining a polymer composite by subjecting polybutadiene (B) containing 40 mass% or more 1,2-butadiene unit to radical crosslinking reaction with a crosslinking agent (C) in a solvent in the presence of a polymer compound (A) containing 50 mass% or more polyphenylene ether (a) and not having a crosslinked structure and crosslinking reactivity; a step of obtaining an inorganic particle (D) by surface-treating the surface of an inorganic particle with styryltrialkoxysilane and thereafter successively surface-treating with an alkoxysilane-based (excluding one having a vinyl group) and/or silicone-based compound, or by surface-treating in reverse sequence; and a step of mixing the polymer composite and the inorganic particle (D). <P>COPYRIGHT: (C)2012,JPO&INPIT |
