发明名称 WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPRINT SENSOR
摘要 This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
申请公布号 US2012092350(A1) 申请公布日期 2012.04.19
申请号 US201113271065 申请日期 2011.10.11
申请人 GANAPATHI SRINIVASAN KODAGANALLUR;BUCHAN NICHOLAS IAN;PETERSEN KURT EDWARD;SHENOY RAVINDRA V.;LIN PENG CHENG;CHENG ERICSON;QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 GANAPATHI SRINIVASAN KODAGANALLUR;BUCHAN NICHOLAS IAN;PETERSEN KURT EDWARD;SHENOY RAVINDRA V.;LIN PENG CHENG;CHENG ERICSON
分类号 G06T1/00;H05K3/00;H05K7/00 主分类号 G06T1/00
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