| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing method capable of preventing a substrate from being damaged when a molding obtained by resin sealing a semiconductor element mounted on the substrate is released from a mold. <P>SOLUTION: The resin sealing device comprises an upper mold set equipped with a holding mechanism capable of holding a substrate 1 on the lower surface, and a lower mold set mounting a cavity block 63 having a cavity on the upper surface and capable of reciprocating between a molding position and a standby position along a base plate via a horizontal movement mechanism. Frame guides 65 are arranged on at least two sides of the outer periphery of the cavity block 63, and the mold is released by pushing up the outer peripheral edge of the substrate 1 by means of the frame guides 65. <P>COPYRIGHT: (C)2012,JPO&INPIT |
