| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic electronic component less susceptible to displacement when a ceramic green block is cut by a dicer. <P>SOLUTION: When manufacturing a multilayer ceramic capacitor, a ceramic green block is prepared. The ceramic green block includes a plurality of ceramic green sheets stacked one upon another, and has a cut mark on a side surface thereof. The ceramic green block is mounted on a table. Then, by applying cutting water to the ceramic green block before cutting and the table, a surface temperature of the ceramic green block before cutting is brought near a surface temperature of the ceramic green block during cutting. Thereafter, the ceramic green block is cut by the dicer to a predetermined size while applying the cutting water to the ceramic green block with reference to the cut mark. <P>COPYRIGHT: (C)2012,JPO&INPIT |
