发明名称 CONDUCTIVE PASTE AND CONDUCTIVE PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductive pattern which can obtain stable and excellent electrical characteristics without using a high temperature process. <P>SOLUTION: A conductive paste includes conductive powder containing silica core silver particles consisting of silica particles whose surfaces are coated with silver, organic binder resin, and an organic solvent. Preferably, the conductive paste is one in which the silver content of the silica core silver particles is 5-50 mass%. More preferably, the conductive paste is one in which the silica core silver particles are surface treated with a hydrophobic dispersion agent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079457(A) 申请公布日期 2012.04.19
申请号 JP20100221463 申请日期 2010.09.30
申请人 TAIYO HOLDINGS CO LTD 发明人 SASAKI MASAKI
分类号 H01B1/22;H01B1/00;H01B5/14;H01B13/00;H05K1/09;H05K3/12 主分类号 H01B1/22
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