| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain polyamideimide solution and a polyamide film which have excellent heat resistance and further has excellent solubility to an organic solvent and low thermal linear expansibility, to provide a product or a member which requires high heat resistance and low thermal linear expansibility using the polyamideimide, and to provide a product and a member which are suitable for application in which a polyamideimide resin is formed on the surface of inorganic matter such as glass, metal, metal oxide, single crystal silicon. <P>SOLUTION: The coating film is formed using a coating resin solution containing a resin having a specific structure and an organic solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
