Method for manufacturing set of electronic units in high-frequency circuit of mobile telephone, involves applying electromagnetic protective layer on electronic unit to cover side surfaces of substrate uncovered by isolation process

摘要

The method involves providing a laminarly expanding panel including a substrate (120). The panel is isolated from an electronic unit (111). Plasma cleaning of the electronic unit is performed. An electromagnetic protective layer (130) is applied on the electronic unit by sputter deposition of partial layers such that the protective layer covers side surfaces (121, 122) of the substrate, which are uncovered by the isolation process. The side surfaces are arranged transverse to a surface of the electronic unit, where the partial layers contain titanium, nickel and copper. An independent claim is also included for an electronic unit including an electromagnetic protective layer.