Method for electrically testing wafers of e.g. heating equipment by test arrangement, involves detecting and/or inputting temperature of test object, and adapting temperature of contacting device to detected temperature of object

摘要

The method involves arranging electrical test contacts (10) of an electrical contacting device (2) in respective retainers (8) of a guide substrate (6) i.e. guiding plate (7). The tests contacts are brought to contact to a test object (4) i.e. wafer, with an end (34) of the contacting device and electrically connected with an electrical connection device (36) of the contacting device with another end (35). Temperature of the test object is detected and/or input, where temperature of the contacting device is adapted to the detected and/or input temperature of the test object. An independent claim is also included for a test arrangement for electrically testing electrical test objects.