| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for thinned and flattened RFID (Radio Frequency IDentification) tag which exchanges information with external devices without contact and a RFID tag manufactured by using the method. <P>SOLUTION: A tag sheet 320 where a metal pattern 322 which functions as an antenna after assembly and an IC chip 11 are attached is pressed onto a substrate 310 where a conductive material 313 and a hole 314 are provided in such a manner that the CI chip 11 can be housed in the hole 314. Both parts of the tag sheet 320 protruding from the substrate 310 are bent along the edges of the substrate 310, and are folded along the edges so that both the ends of the metal pattern 322 will connect to each other through the conductive material 313. <P>COPYRIGHT: (C)2012,JPO&INPIT |
