发明名称 SPUTTERING DEVICE, SPUTTERING METHOD, AND METHOD OF MANUFACTURING RESIN FILM WITH METAL BASE LAYER
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering device capable of efficiently manufacturing a heat-resistant resin film with metal base layers on both surfaces thereof excelling in flatness and productivity. <P>SOLUTION: While a heat-resistant resin film 112 wound off from a winding-off roll 111 is folded back by drive rolls 118, 119, 120, 121, 122, 123, film deposition progresses at the same time on a first film deposition surface and a second film deposition surface of the heat-resistant resin film 112 by at least four units of facing sputtering units 129, 130, 131, 132 having openings in the direction of the heat-resistant resin film 112 and each including two openings. One sides of the facing sputtering units 129, 132 at both ends are formed by single-sided film deposition. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012077330(A) 申请公布日期 2012.04.19
申请号 JP20100221727 申请日期 2010.09.30
申请人 SUMITOMO METAL MINING CO LTD 发明人 OGAMI HIDEHARU
分类号 C23C14/56;B32B15/08;C23C14/34 主分类号 C23C14/56
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