发明名称 |
PAD STRUCTURE HAVING CONTACT BARS EXTENDING INTO SUBSTRATE AND WAFER HAVING THE PAD STRUCTURE |
摘要 |
A pad structure in a semiconductor wafer for wafer testing is described. The pad structure includes at least two metal pads connected there-between by a plurality of conductive vias in one or more insulation layers. A plurality of contact bars in contact with the bottom-most metal pad extends substantially vertically from the bottom-most metal pad into the substrate. An isolation structure substantially surrounds the plurality of contact bars to isolate the pad structure. |
申请公布号 |
US2012091455(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
US20110984669 |
申请日期 |
2011.01.05 |
申请人 |
CHEN YING-JU;CHEN HSIEN-WEI;TSAI HAO-YI;LII MIRNG-JI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN YING-JU;CHEN HSIEN-WEI;TSAI HAO-YI;LII MIRNG-JI |
分类号 |
H01L23/485;H01L29/06 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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