PRINTED WIRING BOARD, MANUFACTURING METHOD THEREOF, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve connection reliability on the bottom surface of a via hole used for interlayer conduction.

SOLUTION: An printed wiring board includes: a first isolation layer 21a that has flexibility; a seed layer 22a that is provided on a first main surface of the first isolation layer 21a; a first conductor circuit 23a provided on the seed layer 22a; a conductor layer 28a that is provided on the seed layer 22a exposed on the bottom surface of a via hole penetrating through the first isolation layer 21a; and an interlayer conduction part 24a that is embedded in the via hole and contacts the conductor layer 28a exposed on the bottom surface of the via hole. The compatibility between the interlayer conduction part 24a and the conductor layer 28a is higher than the compatibility between the interlayer conduction part 24a and the seed layer 22a.

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