| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gas sensor in which an insulating film with a gas sensing part is provided on one surface of a semiconductor chip, a cavity is provided to the semiconductor chip on the rear surface of the gas sensing part, the semiconductor chip penetrates from the one surface to the opposite surface, includes a conductive via electrically connected to the gas sensing part, and wiring which is provided on the opposite surface and connected to the via, and the gas sensing part is covered with a breathable cover fixed to the semiconductor chip. <P>SOLUTION: A gas sensor is mounted on a printed circuit board with neither die bonding nor wire bonding to a package. <P>COPYRIGHT: (C)2012,JPO&INPIT |
