HYBRID SUBSTRATE, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

This hybrid substrate is composed of a glass woven fabric that functions as a reinforcing material, and a core layer that is constituted from a glass-ceramic sintered body containing at least a glass component and a metal oxide component. In the substrate core layer, the glass woven fabric and the glass-ceramic sintered body that is formed by impregnation to the glass woven fabric, are integrated by firing.