| 摘要 |
PURPOSE: A lead frame assembly and a light emitting diode array module thereof are provided to shortened manufacturing process and manufacturing time by omitting a process which mounts a separate light emitting device package unit on the surface. CONSTITUTION: First and second supporting frames(100a, 100b) are parallelly arranged to an X-axis direction. A light emitting diode array module(200) is arranged between the first and second supporting frames at constant intervals. The light emitting diode array module comprises a supporting substrate of a bar type and a plurality of light emitting diodes(220). A first fixing unit(300a) and a second fixing unit(300b) are arranged to a Y-axis direction which is perpendicular to the X-axis direction. First and second conductivity extension units(400a, 400b) are connected to both ends of the light emitting diode array module. |
