| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED device that prevents uselessness of phosphor, has excellent luminous efficiency, and can be manufactured easily even if the device has phosphor and a structure in which side surfaces of an LED element are buried in a white (reflective) member. <P>SOLUTION: An LED element 21 is flip-chip mounted on a circuit board 22. The LED element 21 has a phosphor layer 15 on the surface opposite to the mounting surface of the circuit board 22, and a white member 11 surrounds the side surfaces of the LED element 21 and the phosphor layer 15. The top surfaces of the phosphor layer 15 and the white member 11 are substantially aligned. <P>COPYRIGHT: (C)2012,JPO&INPIT |
