发明名称 SUBSTRATE HOLDING DEVICE AND SUBSTRATE MACHINING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To hold a substrate in a state where an influence of distortion and deflection of a substrate caused by self-weight of the substrate and contact pressure of a terminal is further reduced. <P>SOLUTION: A substrate 15 is supported via movable contact parts 103 contactably provided to the lower part of the substrate. Force supporting the self-weight of the substrate 15 is made equal between the movable contact parts 103 by moving or deforming each movable contact part 103 by common liquid. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079917(A) 申请公布日期 2012.04.19
申请号 JP20100223602 申请日期 2010.10.01
申请人 TOPPAN PRINTING CO LTD 发明人 YOSHII TAKASHI
分类号 H01L21/683;H01L21/027 主分类号 H01L21/683
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