发明名称 DEVICE AND METHOD FOR SUPPLYING ADHESIVE
摘要 <P>PROBLEM TO BE SOLVED: To provide a device and method for supplying an adhesive which can prevent sticking out of the adhesive from a work due to fluidization while achieving uniform supply of the adhesive to the work. <P>SOLUTION: The adhesive supply device which supplies an adhesive R to a work S1 which is an object to be bonded includes an adhesive supply portion 1 for heating the adhesive R which is supplied to the work S1, a cooling portion 2 for cooling the adhesive R which has been supplied to the work S1, and a first heating portion for heating the adhesive R before bonding, and further has a second heating portion for heating the adhesive R before bonding after the cooling by the cooling portion 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012076011(A) 申请公布日期 2012.04.19
申请号 JP20100222906 申请日期 2010.09.30
申请人 SHIBAURA MECHATRONICS CORP 发明人 NARITA HISASHI
分类号 B05C11/10;B05C5/00;B05D3/02;B05D7/24 主分类号 B05C11/10
代理机构 代理人
主权项
地址