| 摘要 |
A method of manufacturing an embedded PCB comprises a first step of forming an internal circuit pattern exposing a chip terminal of an electronic device chip embedded in an insulating layer and a second step of forming a first circuit pattern that directly connects the chip terminal and the internal circuit pattern. The embedded PCB produced by the manufacturing method includes an electronic device chip including an external chip terminal, a first circuit pattern including a connecting region that is directly connected to the end of the chip terminal of the electronic device chip, an insulating layer in which the electronic device chip and the first circuit pattern are embedded, and a second circuit pattern electrically connected to the first circuit pattern. Accordingly, embedded components and the PCB can be directly connected without using an additional structure such as via/land, metal bump/land, solder/pad or conductive paste/pad to achieve micro fine pitch input/output interconnection, secure commoditization of electronic components and maximize the degree of freedom in the design of PCB. |
