| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting machine with high efficiency for transferring electronic components. <P>SOLUTION: An electronic component mounting machine 1 comprises a substrate transferring device 36 having a plurality of substrate transferring parts 360f, 360r for transferring circuit boards Bf, Br at a transferring altitude C1 and stopping the circuit boards Bf, Br in mounting areas Af, Ar; a substrate lifting device 35 having a plurality of substrate lifting parts 350f, 350r for rising the circuit boards Bf, Br from the transferring altitude C1 to a mounting altitude C2; a component supply device 4 for supplying electronic components Pf, Pr to an adsorption position B1; a mounting head 32 having an adsorption nozzle 320 for adsorbing the electronic components Pf, Pr at the adsorption position B1 and mounting them to a mounting position B2 of the circuit boards Bf, Br; and a control device 7. When the mounting head 32 transfers the electronic component Pr from the adsorption position B1 to the mounting position B2 of the second circuit board Br, the control device 7 sets the altitude of the first circuit board Bf to a stand-by altitude B3 not less than the transferring altitude C1 and less than the mounting altitude C2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
