发明名称 FLEX-RIGID CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a flex-rigid circuit board with conductive paste via-holes and a manufacturing method of the flex-rigid circuit board. <P>SOLUTION: A flex-rigid circuit board includes a flexible circuit board, a rigid circuit board and circuit structures. The flexible circuit board includes a first dielectric layer and a first circuit layer. The first dielectric layer has a first surface. The first circuit layer is provided on the first surface. The periphery of the rigid circuit board and the periphery of the flexible circuit board are located adjacent to each other. The circuit structure is provided on the flexible circuit board and the rigid circuit board. The circuit structure includes a second dielectric layer, a second circuit layer and a conductive paste via-hole. The second dielectric layer is provided on the flexible and rigid circuit boards, and covers a part of the first circuit layer. The second circuit layer is provided on the second dielectric layer. The conductive paste via-hole is provided in the second dielectric layer, and electrically connects the first and second circuit layers to each other. An interface is provided between the conductive paste via-hole and the second circuit layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079866(A) 申请公布日期 2012.04.19
申请号 JP20100222693 申请日期 2010.09.30
申请人 KINKO DENSHI KOFUN YUGENKOSHI 发明人 HSIEH CHIEN-YEN;CHANG HUNG-LIN
分类号 H05K3/46 主分类号 H05K3/46
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