| 发明名称 |
Method and Apparatus for Improving Substrate Warpage |
| 摘要 |
A package substrate includes conductive layers and a dielectric interposed between the conductive layers. The dielectric includes a stiffening material component and a neat resin doped with a negative coefficient of thermal expansion (CTE) fiber.
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| 申请公布号 |
US2012090883(A1) |
申请公布日期 |
2012.04.19 |
| 申请号 |
US201113183875 |
申请日期 |
2011.07.15 |
| 申请人 |
BCHIR OMAR J.;SHAH MILIND P.;MOVVA SASHIDHAR;QUALCOMM INCORPORATED |
发明人 |
BCHIR OMAR J.;SHAH MILIND P.;MOVVA SASHIDHAR |
| 分类号 |
H05K1/00;H05K3/00 |
主分类号 |
H05K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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