发明名称 |
COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR |
摘要 |
First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
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申请公布号 |
US2012093954(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
US201113335460 |
申请日期 |
2011.12.22 |
申请人 |
YAMADA TETSUYA;GOTOH TOMOYUKI |
发明人 |
YAMADA TETSUYA;GOTOH TOMOYUKI |
分类号 |
B29C43/18;B29C43/34;B29C43/36;B29C43/58;B29K83/00;H01L21/56 |
主分类号 |
B29C43/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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