发明名称 |
MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY |
摘要 |
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance. |
申请公布号 |
US2012091104(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
US201113081412 |
申请日期 |
2011.04.06 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TAVASSOLI HAMID;KUMAR SURAJIT;BERA KALLOL;ZHOU XIAOPING;NEVIL SHANE C.;BUCHBERGER, JR. DOUGLAS A. |
分类号 |
B23K10/00;B23B31/28 |
主分类号 |
B23K10/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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