发明名称 ALIGNMENT MARK SUBSTRATE, ELEMENT AND METHOD FOR MANUFACTURING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate with an alignment mark, on which alignment can be performed with high precision when a transparent conductive part is formed in a pattern shape and a pattern-shaped functional layer is laminated so as to correspond to the transparent conductive part. <P>SOLUTION: An alignment mark substrate 10 comprises: a substrate 11; and an alignment mark layer 12 formed on the substrate 11 and having a recessed part 13 for alignment on a surface thereof, the recessed part being formed in a recessed form. In the alignment mark substrate, when a transparent conductive part 21 such as a transparent electrode or a transparent semiconductor is formed on the alignment mark layer 12 and a functional layer 22 is further formed on the transparent conductive part 21, the recessed part 13 for alignment is used as a reference, so that alignment can be performed precisely even if the transparent conductive part 21 is transparent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079738(A) 申请公布日期 2012.04.19
申请号 JP20100220712 申请日期 2010.09.30
申请人 DAINIPPON PRINTING CO LTD 发明人 IWATA OSAMU
分类号 H01L21/027;G03F7/20;H01L21/336;H01L29/786 主分类号 H01L21/027
代理机构 代理人
主权项
地址