| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify a structure of a substrate adhering device. <P>SOLUTION: A heating device comprises a first induction heating part arranged on one face side of plural substrates overlaid on each other and induction heating at least one of plural substrates; and a second induction heating part arranged on the other face side of the plural substrates and induction heating at least one of the plural substrates. The heating device further comprises a first stage contacting one face side of the plural substrates, and a second stage opposed to the first stage and nipping the plural substrates between it and the first stage from the other face side of the plural substrates. The first induction heating part is arranged on the first stage, and the second induction heating part may be arranged on the second stage. <P>COPYRIGHT: (C)2012,JPO&INPIT |
