| 摘要 |
A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.
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