| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably connect a semiconductor chip and a wiring board at a low cost. <P>SOLUTION: A semiconductor device comprises a semiconductor chip and a wiring board 500. The semiconductor chip has a bump electrode 300 on an electrode pad 120. Bump electrode protrusions 320 are partially formed on a surface of the bump electrode 300. The bump electrode 300 is directed to the side of the wiring board 500, whereby the semiconductor chip is connected to the wiring board 500. The bump electrode protrusions 320 on the bump electrode 300 are in direct contact with an electrode 520 of the wiring board 500. <P>COPYRIGHT: (C)2012,JPO&INPIT |
