发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can form a high-definition baked product pattern, and can form the pattern without causing missing lines due to undercut, in a bus electrode having a double-layered structure that includes a black layer and a white layer, and to provide a baked product pattern using the same and a plasma display panel having the baked product pattern. <P>SOLUTION: The photosensitive resin composition contains a photoinitiator including inorganic fine particles, an organic binder and an oxime ester compound represented by the general formula (I). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012078427(A) 申请公布日期 2012.04.19
申请号 JP20100221374 申请日期 2010.09.30
申请人 TAIYO HOLDINGS CO LTD 发明人 USHIYAMA KOSUKE;ITO HIDEYUKI
分类号 G03F7/031;G03F7/004;G03F7/095;H01J9/02;H01J11/22;H01J11/34 主分类号 G03F7/031
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