发明名称 BARREL APPARATUS FOR BARREL PLATING
摘要 <P>PROBLEM TO BE SOLVED: To decrease the electrical resistance in barrel plating, to improve plating efficiency, to decrease the amount of electricity, and to thereby contribute to the improvement of environment. <P>SOLUTION: In the barrel plating, a barrel having openings at both ends is used, a workpiece is accommodated inside the barrel and immersed in a plating liquid, a power is supplied to a negative electrode that is arranged inside the barrel from the opening and a positive electrode that is arranged in the plating liquid, and electroplating is performed while rotating the barrel about a center shaft. In the barrel plating, the positive electrode portion 15 to be disposed inside the barrel is arranged: at an upper and left position inside the barrel, which is apart from and opposite to the workpiece W that is deposited at a lower and right portion inside the barrel, when the barrel 11 is seen from a rear portion of the barrel and when the barrel rotates in a counter-clockwise direction; or at an upper and right position inside the barrel, which is apart from and opposite to the workpiece W that is deposited at a lower and left portion inside the barrel, when the barrel is seen from a rear portion of the barrel and when the barrel rotates in a clockwise direction. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012077335(A) 申请公布日期 2012.04.19
申请号 JP20100222176 申请日期 2010.09.30
申请人 MITAKA SEISAKU:KK 发明人 SUZUKI MICHIMASA
分类号 C25D17/20;C25D17/16;C25D17/22 主分类号 C25D17/20
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