| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce external force acting on an actuator and a connecting portion between a COF and the actuator when a heat sink is brought into contact with a drive IC. <P>SOLUTION: A wiring board unit 9 comprises: the COF 50 connected to one surface of the piezoelectric actuator 7 and having the drive IC 52 mounted thereon; and a heat sink 61 disposed in contact with the drive IC 52, thereby dissipating the heat of the drive IC 52. A part of the COF 50 is disposed opposite the one surface of the piezoelectric actuator 7. The drive IC 52 and piezoelectric actuator 7 are disposed so as to sandwich the portion of the COF 50, which portion is opposite the piezoelectric actuator 7. Further, a guide rail 58a extending in a direction inclining to the one surface of the piezoelectric actuator 7 is provided. The guide rail 58a guides the heat sink 61 from the position where it does not come in contact with the surface of the drive IC 52 to the attached position where it comes in contact with the surface of the drive IC 52. <P>COPYRIGHT: (C)2012,JPO&INPIT |
