发明名称 LIGHT-EMITTING DIODE CHIP
摘要 The invention specifies a light-emitting diode chip, having - at least two semiconductor bodies (1), wherein each semiconductor body (1) comprises at least one active area (11) set up to generate radiation, - a carrier (2) having a top side (2a) and an underside (2b) facing away from the top side (2a), and - an electrically insulating connecting means (3) which is arranged on the top side (2a) of the carrier, wherein - the electrically insulating connecting means (3) is arranged between the semiconductor bodies (1) and the top side (2a) of the carrier, - the electrically insulating connecting means (3) provides mechanical contact between the semiconductor bodies (1) and the carrier (2), and - at least some of the semiconductor bodies (1) are electrically connected in series with one another.
申请公布号 WO2012049023(A1) 申请公布日期 2012.04.19
申请号 WO2011EP66873 申请日期 2011.09.28
申请人 OSRAM OPTO SEMICONDUCTORS GMBH;VON MALM, NORWIN;ILLEK, STEFAN;STEEGMUELLER, ULRICH 发明人 VON MALM, NORWIN;ILLEK, STEFAN;STEEGMUELLER, ULRICH
分类号 H01L27/15 主分类号 H01L27/15
代理机构 代理人
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