发明名称 |
LIGHT-EMITTING DIODE CHIP |
摘要 |
The invention specifies a light-emitting diode chip, having - at least two semiconductor bodies (1), wherein each semiconductor body (1) comprises at least one active area (11) set up to generate radiation, - a carrier (2) having a top side (2a) and an underside (2b) facing away from the top side (2a), and - an electrically insulating connecting means (3) which is arranged on the top side (2a) of the carrier, wherein - the electrically insulating connecting means (3) is arranged between the semiconductor bodies (1) and the top side (2a) of the carrier, - the electrically insulating connecting means (3) provides mechanical contact between the semiconductor bodies (1) and the carrier (2), and - at least some of the semiconductor bodies (1) are electrically connected in series with one another. |
申请公布号 |
WO2012049023(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
WO2011EP66873 |
申请日期 |
2011.09.28 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;VON MALM, NORWIN;ILLEK, STEFAN;STEEGMUELLER, ULRICH |
发明人 |
VON MALM, NORWIN;ILLEK, STEFAN;STEEGMUELLER, ULRICH |
分类号 |
H01L27/15 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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