MULTI-COMPONENT ELECTRONIC SYSTEM HAVING LEADFRAME WITH SUPPORT-FREE CANTILEVER LEADS

摘要

A pallet (501) supporting a half-etched leadframe with cantilever-type leads (403) without metallic supports during the step of attaching components (510) to the leads in order to assemble an electronic system. After assembly, the pallet is removed before the molding step that encapsulates the components on the leadframe and mechanically supports the cantilever leads. The pallet is machined from metal or inert plastic material, tolerates elevated temperatures during soldering, and is reusable for the next assembly batch.