METHOD FOR MANUFACTURING AN IMAGE SENSOR HAVING A THREE-DIMENSIONAL STRUCTURE

摘要

The present invention relates to a method for manufacturing an image sensor having a three-dimensional structure, and more particularly, to a method for manufacturing an image sensor having a three-dimensional structure, which enables a bonding pad of a first wafer and a bonding pad of a second wafer to be protruded to allow for ease of coupling between the bonding pads of the first and second wafers during bonding. The method for manufacturing an image sensor having a three-dimensional structure according to the present invention comprises a first wafer forming step, a second wafer forming step, a wafer etching step and a wafer bonding step, wherein a passivation layer is etched to enable the first bonding pad and the second bonding pad to be protruded from the surfaces of the respective wafers in the wafer etching step.