摘要 |
The present invention relates to an apparatus and a method for printing process simulation, and more particularly, to an apparatus and a method for printing process simulation which automatically investigate the adhesion characteristics among materials for a printing process and effects of process conditions on the adhesion characteristics. According to the present invention, adhesion characteristics among a stamp, ink, a base material and a substrate can be automatically calculated using a load sensor or the like. |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS;KIM, KWANG-SEOP;KIM, JAE-HYUN;JANG, BONG KYUN;LEE, HAK-JOO |
发明人 |
KIM, KWANG-SEOP;KIM, JAE-HYUN;JANG, BONG KYUN;LEE, HAK-JOO |