Radiation cross-linkable hot-melt contact adhesives

摘要

The invention relates to a radiation cross-linkable hot-melt contact adhesive based on: radiation cross-linkable epoxidized polyolefins, the epoxy groups being distributed, in essence, over the polymer chain; a constituent (B) provided in the form of a tackifying resin that does not contain any epoxy groups, and optionally; an oligomeric compound (C) that has reactive groups, which can react with the epoxy groups of constituent (A), together with at least one photinitiator and other additives.