发明名称 SOUND INSULATION FLOOR COMPONENT AND SOUND INSULATION FLOOR STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sound insulation floor structure which can restrain a flooring material from sinking due to walking, which can provide a good feeling of walking, and which exerts high sound insulation performance against a floor impact sound. <P>SOLUTION: A sound insulation floor component 10 comprises a rigid layer 15, floor joists 13 which are disposed in parallel at an interval on one surface of the rigid layer 15, and compressed layers 14 which are disposed adjacently to the floor joists 13 in such a manner that the compressed layer and the floor joist alternate with each other and which are thicker than the floor joists. A sound insulation floor structure may also be formed by interposing the sound insulation floor component 10 between a sub-floor material and a floor finishing layer. In the sound insulation floor structure, the compressed layer 14 is compressed up to the thickness of the floor joist. The compressed layer 14 may also be formed of a nonwoven fiber structure with a thickness of 3-60 mm and an apparent density of 0.03-0.2 g/cm<SP POS="POST">3</SP>. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012077600(A) 申请公布日期 2012.04.19
申请号 JP20110190653 申请日期 2011.09.01
申请人 NANAO KOGYO KK;KURARAY CO LTD 发明人 MIYAIE NOBORU;TAKAMATSU MASAHIKO;KINDEI HIDENORI;KOIZUMI SATOSHI;KIYOOKA SUMITO;ADACHI ATSUMI;KOIKE TAKERU
分类号 E04F15/20;E04B1/86;E04F15/18 主分类号 E04F15/20
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