发明名称 |
Metal-Insulator-Metal Capacitor and Method for Manufacturing Thereof |
摘要 |
The disclosure provides a method for producing a stack of layers on a semiconductor substrate. The method includes producing a substrate a first conductive layer; and producing by ALD a sub-stack of layers on said conductive layer, at least one of said layers of the sub-stack being a TiO2 layer, the other layers of the sub-stack being layers of a dielectric material having a composition suitable to form a cubic perovskite phase upon crystallization of said sub-stack of layers. Crystallization is obtained via heat treatment. When used in a metal-insulator-metal capacitor, the stack of layers can provide improved characteristics as a consequence of the TiO2 layer being present in the sub-stack. |
申请公布号 |
US2012092807(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
US201113245247 |
申请日期 |
2011.09.26 |
申请人 |
POPOVICI MIHAELA IOANA;SWERTS JOHAN;PAWLAK MALGORZATA;TOMIDA KAZUYUKI;KIM MIN-SOO;KITTL JORGE;VAN ELSHOCHT SVEN;IMEC |
发明人 |
POPOVICI MIHAELA IOANA;SWERTS JOHAN;PAWLAK MALGORZATA;TOMIDA KAZUYUKI;KIM MIN-SOO;KITTL JORGE;VAN ELSHOCHT SVEN |
分类号 |
H01G4/06;H01G4/20;H01L21/02 |
主分类号 |
H01G4/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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