发明名称 Method of aligning the film in a flip chip bonder
摘要 A method of aligning a thin film tape in a flip chip boner is provided to obtain an alignment margin of the thin film tape by stopping the thin film tape instantly when a sixth hole is detected so as to prevent a control error of a controller. In a first step, a thin film tape is transferred to a first position by a first speed(S10). In a second step, a count hole which is positioned subsequently from the first position is detected(S60). In a third step, the thin film tape is transferred until the count hole is detected by a second speed(S50). In a fourth step, a second position within the count hole is detected. In a fifth step, the thin film tape is stopped until the second position is detected(S90).
申请公布号 KR101138704(B1) 申请公布日期 2012.04.19
申请号 KR20060047250 申请日期 2006.05.25
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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