A semiconductor apparatus comprising a silicon substrate (101); a device housing space (104) including a concave portion (101C) formed in the silicon substrate (101) and a hole (101A) perforating through the bottom surface of the concave portion; a plurality of laminated semiconductor devices provided in the device housing space; a first lid (108) which lids the concave portion and a second lid (107; 107A) which lids the hole, for sealing the semiconductor devices; and via plugs (105) which are connected to any one of the semiconductor devices, penetrating the bottom surface of the concave portion.
