| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to include a solder ball pad and a top side wire redistribution layer between an upper package and a lower package, thereby increasing the number of input/output terminals. CONSTITUTION: A second semiconductor die(320) is molded inside of a second molding part(330). A second wire redistribution layer(360) which has a second redistribution wire is attached on the lower part of the second semiconductor die. A second semiconductor package(300) is formed by attaching a second solder ball on the lower part of the second wire redistribution layer. The second solder ball is electrically connected to the second redistribution wire. A first semiconductor package(200) is laminated on the second semiconductor package.</p> |
