发明名称 METHOD FOR FORMING PATTERN FOR TRANSPARENT CONDUCTIVE LAYER
摘要 <p>Provided is a low-cost method for easily forming a transparent conductive pattern that has a low electrical resistance and high transparency, and that is highly invisible to the eye. The method for forming a transparent conductive layer pattern includes the steps of (1) detachably forming a transparent conductive layer on a substrate; (2) then forming, on a support, a negative-patterned heat-sensitive adhesive image; (3) bonding the substrate to the support so that the transparent conductive layer and the heat-sensitive adhesive layer are in close contact with each other; (4) forming a pattern of the transparent conductive layer on the substrate by detaching the support from the substrate to transfer a portion of the transparent conductive layer, the portion being in close contact with the heat-sensitive adhesive layer, to the heat-sensitive adhesive layer; and (5) fixing the transparent conductive layer on the substrate by applying a coating material for a protective layer onto a front surface of the substrate on which the pattern of the transparent conductive layer is formed and impregnating the transparent conductive layer with the coating material.</p>
申请公布号 KR20120036870(A) 申请公布日期 2012.04.18
申请号 KR20117030367 申请日期 2010.06.29
申请人 DIC CORPORATION 发明人 YAMAZAKI YOSHIKAZU;HAYAKAWA SATOSHI;MIYAMOTO MASASHI
分类号 H01B13/00;G06F3/041;H01B5/14 主分类号 H01B13/00
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