SEMICONDUCTOR PACKAGE WITH A DAM THAT DEFINES THE AREA FORMING PROTECTIVE LAYER

摘要

PURPOSE: A semiconductor package equipped with a dam is provided to prevent the damage of a semiconductor chip by eliminating constant resistance between the semiconductor chip and a heat radiation plate touched to the top of a protection layer. CONSTITUTION: A dam(110) is formed on a package substrate(170). The dam is formed in order to completely surround a semiconductor chip(150). The semiconductor chip is formed on the package substrate. A protective layer(130) is formed within a protective layer formation region of the package substrate. The protective layer absorbs heat created in the semiconductor chip and releases the heat. A heat radiation plate(190) is close with the protective layer. The dam comprises a plurality of sub dams. The plurality of sub dams is separately arranged around the semiconductor chip.