Method and system for composite bond wires

摘要

Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create an inner portion (114) of the composite bond wire. A layer of external conductive material (116) is applied to the exterior.