发明名称 Material for substrate comprising inorganic filler having minus -coefficient of Thermal Expansion and Liquid Crystal Thermosetting Oligomer
摘要 The invention relates to a composite material for substrates, in particular to a composite material for substrates containing inorganic filling material and a liquid crystal thermosetting (LCT) oligomer with a negative thermal expansion coefficient.The main chain of the oligomer comprises at least one soluble constitutional unit and at least one end of the main chain comprises at least one thermosetting group.By containing the inorganic filling material with a negative thermal expansion coefficient, the composite material for substrates is good in thermal, electrical and mechanical properties.
申请公布号 KR101136407(B1) 申请公布日期 2012.04.18
申请号 KR20090135806 申请日期 2009.12.31
申请人 发明人
分类号 C08L79/02;C08K3/00;C09K19/56;G02F1/335 主分类号 C08L79/02
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